OFF-HIGHWAY ENGINEERING serves the global off-road vehicle design and development community - specifically those involved in the product design, engineering and testing of materials, components, engines, drivetrains and electronic systems used in off-road, self-propelled vehicles like construction equipment, agricultural machinery, forestry, mining and material handling equipment.
In recent years, more semiconductor and component manufacturer CFOs have acknowledged that margin improvement through cost reduction delivers diminishing value, while front-end processes in sales, pricing, contracts, and channel incentives can have an equal if not greater impact on improving gross margin.
Semiconductor and component manufacturer CFOs are taking center stage in initiating Revenue Management projects and demanding these projects present business and functional requirements that clearly demonstrate the ability to impact margin as one continuum — from opportunity to incentive payment.
This Model N white paper outlines the business challenges facing CFOs of semiconductor and component manufacturers and the implications on gross margins, market cap and revenue recognition.
Written for design engineers working on the design and development of automotive systems, Automotive DesignLine Europe Newsletter delivers how-to design articles, information on hot new products, and spotlight news items that focus on power train, chassis and suspension, body electronics, safety and security, and automotive infotainment systems.
Key topics covered in this newsletter include automotive motor design, automotive electronics, telematics, Bluetooth design, GPS design, hybrid and electric vehicles, sensors and MEMS, developments in fuel cell technology, automotive data bus technologies, automotive vision systems, and more.
Connector Specifier, published monthly, is dedicated to providing design engineers and specifiers with the most current and innovative information about electronic and optical connectors and related topics, with a focus on the latest in connector technologies, design trends and standards.
The Power Management DesignLine Europe Newsletter is the design engineer's knowledge source for controlling performance and power levels in electronic systems.
This newsletter includes the latest news, products, and how-to articles covering all aspects of power supplies and components, UPS, battery management, and new technologies, highlighting the latest articles and practical information posted to our PowerManagementDesignLine site and delivering announcements, white papers, data sheets, and design notes from key company sites.
Solid State Technology magazine is the longest-running and most complete source of information for engineers, operators, managers, tool and materials suppliers, and semiconductor researchers, providing global access to the most influential buying powers in the semiconductor industry.
LEDs Magazine, the leading global information source on the technology and applications of LEDs, is a bimonthly publication available by FREE subscription as an electronic (PDF) download. The magazine contains technical articles, case studies, application notes, product information, business and financial news, and a wide variety of other information relevant to the LED industry.
Aerospace Manufacturing and Design provides up-to-date information on the latest developments in materials, manufacturing processes, and design principals for the machining and assembly of components in today's fast growing aviation sector.
Aerospace Manufacturing and Design delves into all aspects of the production of commercial, military, and private aircraft and new equipment, informing manufacturers about the latest technology and enabling them to produce products competitively and profitably.
Control Engineering is the must-read information source for engineering decision makers in the global control, instrumentation, and automation marketplace. For more than five decades, Control Engineering has been providing premier information on technology, products, news, and trends in processing, discrete, and hybrid manufacturing industries. Each issue provides the right balance of editorial to keep you on top of the latest industry developments.
This monthly magazine features exclusive reports of innovations developed by NASA and its industry partners that can be applied to develop new and improved products and solve engineering or manufacturing problems.
Authored by the engineers or scientists who did the work, the briefs span a wide array of fields, including electronics, physical sciences, materials, computer software, mechanics, machinery/automation, manufacturing/fabrication, mathematics/information sciences, and life sciences. NASA Tech Briefs also contains feature articles on successful NASA spinoffs, profiles of NASA tech transfer resources, news briefs, and application stories. Regular columns describe new patents, industry products, software, and literature.
Do you import products into the European Union or the European Free Trade Area? Find out if your product must carry the CE Mark to meet legal requirements.
Who Should Attend?
All those who have an interest in learning the basics of CE Mark requirements, including but not limited to:
Compliance and regulatory managers and engineers, Company management, Design managers and engineers, Purchasing and contract review personnel.
What Will You Learn?
EE Times Asia serves the electronic engineering community by delivering the latest industry and technology trends and explaining how those trends impact the engineering realities of the region.
EE Times Asia fills the engineering community's on-going need for trends-analysis and "how-to" application that can be referenced again and again. By delivering relevant information at a time and in a format that's appropriate to this community's current design needs, EE Times Asia better prepares the region's engineers to compete in today's fast-changing technology marketplace.
Produced eight times a year for engineers, R&D, manufacturing specialists, and end-users of semiconductor packaging worldwide, Chip Scale Review covers the chip-scale packaging market with thoroughness unmatched by any other journal.
The mission of Chip Scale Review is to promote the growth of semiconductor packaging technologies that influence design assembly and manufacturing using chip-scale electronics. Sign up now to take advantage of this free subscription!
Scientific Computing World is Europe's only publication dedicated to the computing and information technology needs of professionals working in science and engineering.
The bi-monthly magazine covers all aspects of scientific computing, from the ways in which the latest software is revolutionizing research to the practicalities of new product installations. With a 15-year track record of editorial excellence and more than 80, 000 readers, Scientific Computing World is the market leader for the sector.
Interference Technology is the information source for engineering professionals working with interference problems: preventing EMI (electromagnetic interference) and achieving EMC (electromagnetic compatibility).
Interference Technology publishes a weekly e-newsletter and three annual guides/reference directories focusing on EMC design, standards updates, and testing methods. The printed guides also contain case studies, practical design articles, and directories of industry sources to help engineers quickly find solutions to EMI/RFI problems.
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